Shield, Package Structure And Semiconductor Package Having The Shield And Fabrication Method Of The Semiconductor Package

A fabrication method of a semiconductor package is disclosed, which includes the steps of: providing a substrate having at least a carrying region and a cutting region defined on a surface thereof, wherein the cutting region surrounds the carrying region; disposing at least an electronic element on...

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Bibliographic Details
Main Authors HSU TSUNG-HSIE, CHUNG KUANG-NENG, HUANG TIENUNG, CHUNG HSIN-LUNG
Format Patent
LanguageChinese
English
Published 22.10.2014
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A fabrication method of a semiconductor package is disclosed, which includes the steps of: providing a substrate having at least a carrying region and a cutting region defined on a surface thereof, wherein the cutting region surrounds the carrying region; disposing at least an electronic element on the carrying region of the substrate; disposing a shield having a recess portion and at least a positioning member extending outwards, on the carrying region of the substrate with the electronic element received in the recess portion and the positioning member extending outwards to the cutting region; and performing a cutting process along the cutting region to remove portions of the positioning member and the substrate. Therefore, the shield is precisely positioned on the substrate.
Bibliography:Application Number: CN201310153304