Adhensive sheet

• Main Authors: MIKI MORITA, KATSUTOSHI KAMEI, TOMOKAZU TAKAHASHI, SATOSHI HONDA
• Format: Patent
• Language: Chinese; English
• Published: 17.09.2014
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; DYES; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; USE OF MATERIALS AS ADHESIVES

The invention provides an adhensive sheet capable of preventing grinding water and / or griding chips from intruding between the adhesive sheet and a semiconductor wafer when being attached to the semiconductor wafer and provided for griding operation carried out to the back side of the semiconducto...