Adhensive sheet

The invention provides an adhensive sheet capable of preventing grinding water and / or griding chips from intruding between the adhesive sheet and a semiconductor wafer when being attached to the semiconductor wafer and provided for griding operation carried out to the back side of the semiconducto...

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Bibliographic Details
Main Authors MIKI MORITA, KATSUTOSHI KAMEI, TOMOKAZU TAKAHASHI, SATOSHI HONDA
Format Patent
LanguageChinese
English
Published 17.09.2014
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
USE OF MATERIALS AS ADHESIVES
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Summary:The invention provides an adhensive sheet capable of preventing grinding water and / or griding chips from intruding between the adhesive sheet and a semiconductor wafer when being attached to the semiconductor wafer and provided for griding operation carried out to the back side of the semiconductor wafer. The adhensive sheet is provided with more than two adhesive layers made by resin. The adhesive layers are characterized in that the ratio (P1-avg/P2-avg) between the phase difference in a first direction (P1-avg) and the phase difference in a second direction (P2-avg) is 0.94 to 1.06 in a line profile with the phase difference as a longitudinal axis (y axis), a measuring distance as a first direction of a transverse axis (x axis) and a second direction perpendicular to the first direction; and the line profile is obtained by an phase image of a surface at a side in contact with an object to be adhered and measured by an atomic force microscope.
Bibliography:Application Number: CN2014187004