Semiconductor Package

A semiconductor package is provided comprising a package substrate having an opening located in a central region thereof and a circuit pattern provided adjacent to the opening. A first semiconductor chip is located on the package substrate and includes first bonding pads. A pair of second semiconduc...

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Bibliographic Details
Main Authors KANG SUN-WO, KIM KIL-SOO
Format Patent
LanguageChinese
English
Published 25.06.2014
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor package is provided comprising a package substrate having an opening located in a central region thereof and a circuit pattern provided adjacent to the opening. A first semiconductor chip is located on the package substrate and includes first bonding pads. A pair of second semiconductor chips are spaced apart from each other across the opening and mounted between the package substrate and the first semiconductor chip. Each of the second semiconductor chips includes a second bonding pad. A connection element is further provided to electrically connect the second bonding pad to a corresponding one of the first bonding pads.
Bibliography:Application Number: CN201310713521