Cooler for semiconductor module, and semiconductor module

• Main Authors: ICHIMURA TAKESHI, MOROZUMI AKIRA, GOHARA HIROMICHI
• Format: Patent
• Language: Chinese; English
• Published: 11.06.2014
• Subjects: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS; BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CONTROL OR REGULATION THEREOF; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERATION; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

Provided is a cooler for a semiconductor module in which it is possible to eliminate an increase in temperature in some semiconductor elements only and to cool the semiconductor elements in a uniform and stable manner. The cooler for a semiconductor module feeds a coolant from the exterior to a water jacket (2A) and cools semiconductor elements disposed on the outer surface thereof. An intake port (24) and an outlet port (25) are disposed on the left side wall (2Ab) of the water jacket (2A). An intake port section (21a) and an outlet port section (22a) both protrude from the same left side wall (2Ab). A flow speed adjustment plate (28) is disposed, parallel to a fin (2C), on a coolant outlet channel (22) which is a second channel disposed parallel to, and at a distance from, a coolant intake channel (21) which is a first channel. Using the pressure generated when the coolant collides with the flow speed adjustment plate (28) makes it possible for the fin (2C) to adjust the flow speed distribution.