Oriented flexible heat conduction material as well as forming technology and application thereof

• Main Authors: DU HONGDA, ZHAO CUIFENG, ZHOU XIAOSONG, XU YAN
• Format: Patent
• Language: Chinese; English
• Published: 23.04.2014
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

The invention provides an oriented flexible heat conduction material. Main components of the oriented flexible heat conduction material are silicon rubber and anisotropism heat conduction packing. A plurality of heat conduction paths which are parallel to each other and continuous are formed in the oriented flexible heat conduction material by linearly and continuously arranging the anisotropism heat conduction packing filled in the silicon rubber in heat conduction path directions. The oriented flexible heat conduction material has good heat conduction property in a particular direction and good flexibility, can form good contact with an interface, is low in interface resistance and can be used for improving a heat dissipation effect very well. The embodiment of the invention also provides a forming technology and an application of the oriented flexible heat conduction material.