Multi-chip module power clip

The application relates to a multi-chip module power clip. A multi-chip leadless module (200) has an integrated circuit (IC), dual re-channel mosfet (110), IC leads (210, 211, 212), gate leads (213, 214), and source leads (217-220). The IC (150) and the dual n-channel mosfet (110) are mounted face d...

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Bibliographic Details
Main Authors YOON SUNGGEUN, BELANI SURESH, WU CHUNG-LIN, SAPP STEVEN, DOSDOS BIGILDIS
Format Patent
LanguageChinese
English
Published 26.03.2014
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The application relates to a multi-chip module power clip. A multi-chip leadless module (200) has an integrated circuit (IC), dual re-channel mosfet (110), IC leads (210, 211, 212), gate leads (213, 214), and source leads (217-220). The IC (150) and the dual n-channel mosfet (110) are mounted face down on the leads. The IC leads (210, 211, 212) are made of planar metal and connect, respectively, to the electrodes TEST, VDD and VM on the IC (150) by using a flip chip technique to assemble the leads on copper pillars or copper studs.
Bibliography:Application Number: CN201310350564