Method for measuring material surface emissivity by virtue of thermal infrared imager rapidly
The invention discloses a method for measuring the material surface emissivity by a thermal infrared imager rapidly, and relates to the technical field of thermal infrared imaging temperature measurement. A thermal infrared imager, a black box and a heating platform are included. The method comprise...
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Main Authors | , , , , |
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Format | Patent |
Language | Chinese English |
Published |
26.03.2014
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Subjects | |
Online Access | Get full text |
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Summary: | The invention discloses a method for measuring the material surface emissivity by a thermal infrared imager rapidly, and relates to the technical field of thermal infrared imaging temperature measurement. A thermal infrared imager, a black box and a heating platform are included. The method comprises the following testing steps: 1) acquiring the response of the black box by the thermal infrared imager under a temperature environment, wherein the process is enough once under the condition of invariable environment temperature, and storing data into a computer for preservation; 2) heating a measured objected to relatively high temperature greater than or equal to 70 DEG C generally, and acquiring the response of the measured object by the thermal infrared imager; 3) operating according to a formula, thereby obtaining an accurate emissivity measurement result. Regarding to the thermal infrared imager, according to the measurement method, only an auxiliary device is required to be added for the thermal infrared i |
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Bibliography: | Application Number: CN20131669324 |