Low-density low-acidicity phenol formaldehyde foam board and preparation technique thereof
The invention relates to the technical field of foam thermal-insulation materials, particularly a low-density low-acidicity phenol formaldehyde foam board which is composed of the following components in parts by weight: 100 parts of phenol aldehyde resin, 1-10 parts of emulsifier, 1-10 parts of tou...
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Main Authors | , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
05.03.2014
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Subjects | |
Online Access | Get full text |
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Summary: | The invention relates to the technical field of foam thermal-insulation materials, particularly a low-density low-acidicity phenol formaldehyde foam board which is composed of the following components in parts by weight: 100 parts of phenol aldehyde resin, 1-10 parts of emulsifier, 1-10 parts of toughener, 7-12 parts of foaming agent, 3-10 parts of inorganic filler, 3-10 parts of flame retardant and 15-25 parts of organic acid curing agent. The organic acid curing agent is composed of more than one of p-toluenesulfonic acid, dimethyl benzenesulfonic acid, sulfocarbolic acid and benzenesulfonic acid. The high-proportion resin is combined with organic mixed acid into which an inorganic filler is added, and two surfaces are respectively coated with a glass fiber felt layer. The density of the prepared phenol formaldehyde foam board is 25-40 kg/m , the pull strength is higher than 0.1 MPa, the close-pore ratio is higher than 90%, the heat conductivity coefficient is 0.023W/(m.k), and the pH value is higher than 4 |
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Bibliography: | Application Number: CN20131610424 |