Low-density low-acidicity phenol formaldehyde foam board and preparation technique thereof

• Main Authors: DENG GANG, JIAO ZHUANG, PENG MIANGUANG, QIN HAIYANG, WANG YUANXI, SONG CHANGXIAO
• Format: Patent
• Language: Chinese; English
• Published: 05.03.2014
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

The invention relates to the technical field of foam thermal-insulation materials, particularly a low-density low-acidicity phenol formaldehyde foam board which is composed of the following components in parts by weight: 100 parts of phenol aldehyde resin, 1-10 parts of emulsifier, 1-10 parts of toughener, 7-12 parts of foaming agent, 3-10 parts of inorganic filler, 3-10 parts of flame retardant and 15-25 parts of organic acid curing agent. The organic acid curing agent is composed of more than one of p-toluenesulfonic acid, dimethyl benzenesulfonic acid, sulfocarbolic acid and benzenesulfonic acid. The high-proportion resin is combined with organic mixed acid into which an inorganic filler is added, and two surfaces are respectively coated with a glass fiber felt layer. The density of the prepared phenol formaldehyde foam board is 25-40 kg/m , the pull strength is higher than 0.1 MPa, the close-pore ratio is higher than 90%, the heat conductivity coefficient is 0.023W/(m.k), and the pH value is higher than 4