Systems and methods for dissipating heat in enclosure

The invention relates to systems and methods for dissipating heat in an enclosure. Specifically, the enclosure is presented. The enclosure includes an outer casing having one or more walls. Further, the enclosure includes a synthetic jet assembly configured to dissipate heat from the one or more wal...

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Bibliographic Details
Main Authors HENDRIK PIETER JACOBUS DE BOCK, BRYAN PATRICK WHALEN, WILLIAM EARL GROSS JR, ROBERT PAUL MEIER
Format Patent
LanguageChinese
English
Published 12.02.2014
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:The invention relates to systems and methods for dissipating heat in an enclosure. Specifically, the enclosure is presented. The enclosure includes an outer casing having one or more walls. Further, the enclosure includes a synthetic jet assembly configured to dissipate heat from the one or more walls, where the synthetic jet assembly includes a bracket operatively coupled to the one or more walls of the outer casing and one or more synthetic jets operatively coupled to the bracket.
Bibliography:Application Number: CN201310327616