Multi-chip packaging system

The invention discloses a multi-chip packaging system comprising a main chip and a memory chip. The memory chip comprises a first input and output circuit. The main chip comprises a second input and output circuit, a bus control module, a third input and output circuit, a first data path, a second d...

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Bibliographic Details
Main Authors DUAN HAIJIE, LI BAOKUI, LIU ZHI
Format Patent
LanguageChinese
English
Published 22.01.2014
Subjects
INFORMATION STORAGE
PHYSICS
STATIC STORES
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Summary:The invention discloses a multi-chip packaging system comprising a main chip and a memory chip. The memory chip comprises a first input and output circuit. The main chip comprises a second input and output circuit, a bus control module, a third input and output circuit, a first data path, a second data path, and a third data path. The first data path is used for connecting the second input and output circuit and the bus control module. The second data path is used for connecting the bus control module and the third input and output circuit. The third data path is used for connecting the second input and output circuit and the third input and output circuit. With the system, when the main chip cannot work normally, the memory chip can be subjected to direct read/write operations. Also, during a test process, an error chip can be accurately located.
Bibliography:Application Number: CN20131521504