Workpiece grinding apparatus

Provided is a workpiece grinding apparatus, comprising a grinding plate with a top surface, a grinding cloth attached on the top surface, a top ring disposed on the grinding plate and being capable of moving up and down and rotating in a horizontal plane, and a retainer disposed on the top ring. The...

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Bibliographic Details
Main Authors YOICHI MOROZUMI, MANABU KASUO, HARUMICHI KOYAMA, MASAKI WADA
Format Patent
LanguageChinese
English
Published 15.01.2014
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:Provided is a workpiece grinding apparatus, comprising a grinding plate with a top surface, a grinding cloth attached on the top surface, a top ring disposed on the grinding plate and being capable of moving up and down and rotating in a horizontal plane, and a retainer disposed on the top ring. The grinding plate can rotate in the horizontal plane. The top ring presses a bearing plate between the grinding plate and the top ring. The bearing plate keeps the workpiece on the bottom surface so as to press the workpiece on the grinding plate. The retainer stops and keeps the bearing plate on a grinding position, and the bearing plate is disposed on the grinding plate and moves to a lower side of the top ring through rotating the grinding plate.
Bibliography:Application Number: CN201310239057