Method for producing package substrate for mounting semiconductor element, package substrate for mounting semiconductor element, and semiconductor package

• Main Authors: KAWASAKI SAORI, TSUBOMATSU YOSHIAKI, WAKABAYASHI AKIHIKO, TAMURA TADASHI, SUZUKI KUNIJI
• Format: Patent
• Language: Chinese; English
• Published: 11.12.2013
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

Provided is a method and the like that is for producing a package substrate for mounting a semiconductor element, can support heightened density, and has superior reliability. The method and the like for producing a package substrate for mounting a semiconductor element has: a step for preparing a multi-layer metal foil that laminates a first carrier metal foil, a second carrier metal foil, and a base metal foil, and forming a core substrate by laminating the multi-layer metal foil to a substrate; a step for physically peeling the first carrier metal foil between the first carrier metal foil and the second carrier metal foil of the multi-layer metal foil; a step for performing a first pattern plating on the second carrier metal foil; a step for forming a laminate by forming an insulating layer, a conductive circuit, and an interlayer connection on the first pattern plating; a step for peeling the laminate together with the carrier metal foil from the core substrate; and a step for forming a 3D circuit or an e