Slide glass structure for temporary bonding and manufacturing method of slide glass structure

• Main Authors: YU DAQUAN, JIANG FENG, JING XIANGMENG
• Format: Patent
• Language: Chinese; English
• Published: 11.12.2013
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention provides a slide glass structure for temporary bonding. The slide glass structure comprises a slide glass wafer. The upper surface of the slide glass wafer is provided with a groove. The bottom part of the groove is provided with a substrate slide glass. The shape of the substrate slide glass matches the shape of the groove, and the thickness of the substrate slide glass is less than the depth of the groove. The upper surface of the substrate slide glass is coated with a layer of buffer glue which is solidified. The upper surface of the solidified buffer glue and the upper surface of the slide glass wafer around the periphery of the groove are coated with temporary bonding glue. Viscosity of buffer glue is repulsive to viscosity of temporary bonding glue. The wafer of a device is bonded with the upper surface of the slide glass wafer around the periphery of the groove via temporary bonding glue. The invention also provides a manufacturing method of the slide glass structure. A low-cost temporary