Thermal transmission device and thermal diffusion device combining method

• Main Author: DING XINGQIANG
• Format: Patent
• Language: Chinese; English
• Published: 27.11.2013
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The invention relates to the field of electronic products, in particular to a thermal transmission device and thermal diffusion device combining method. The thermal transmission device and thermal diffusion device combining method achieves the thermal dissipation aim of the electronic products. Thermal transmission devices and thermal diffusion devices are bonded through thermal interface materials, and the thermal interface materials are thermal conduction silicone grease, phase-change materials or ultra-thin thermal conduction silica gel pads. The thermal transmission devices are thermal tubes or thermal homogenizing plates with the thickness smaller than or equal to 0.6mm. The horizontal thermal diffusion coefficients of the thermal diffusion devices are larger than or equal to 300mm /s, or the thermal conductivity coefficients of the thermal diffusion devices are larger than or equal to 60W/mk. The whole thermal diffusion coefficients of the thermal diffusion devices are larger than or equal to 300mm /s,