Package substrate, flip-chip type package and manufacturing method thereof

The invention discloses a package substrate, a flip-chip type package and a manufacturing method of the flip-chip type package. The package substrate comprises a substrate body, a plurality of metal conductors and a plurality of thin membranes. The substrate body is provided with a first substrate s...

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Bibliographic Details
Main Authors SHAO YUXIU, XIAO YOUXIANG, LIN GUANGLONG, YANG BINGFENG
Format Patent
LanguageChinese
English
Published 23.10.2013
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The invention discloses a package substrate, a flip-chip type package and a manufacturing method of the flip-chip type package. The package substrate comprises a substrate body, a plurality of metal conductors and a plurality of thin membranes. The substrate body is provided with a first substrate surface and a second substrate surface, wherein the first substrate surface and the second substrate surface are opposite to each other. The metal conductors are arranged on the first substrate surface of the substrate body. The metal conductors are provided with an upper conductor surface and a plurality of side conductor surfaces. The thin membranes are formed on the side conductor surfaces of the metal conductors.
Bibliography:Application Number: CN201310306505