Circuit board and manufacturing method of circuit board

The invention relates to a circuit board which comprises a substrate, at least one bonding pad arranged on the substrate and metal coating coated on the substrate. Each bonding pad comprises copper foil arranged on the substrate in a sinking manner and solder mask annularly arranged around the coppe...

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Bibliographic Details
Main Authors ZHANG CUICUI, PENG XIAOZHAN, NIE QIANG, ZHANG JUNCUI
Format Patent
LanguageChinese
English
Published 18.09.2013
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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