Circuit board and manufacturing method of circuit board

The invention relates to a circuit board which comprises a substrate, at least one bonding pad arranged on the substrate and metal coating coated on the substrate. Each bonding pad comprises copper foil arranged on the substrate in a sinking manner and solder mask annularly arranged around the coppe...

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Bibliographic Details
Main Authors ZHANG CUICUI, PENG XIAOZHAN, NIE QIANG, ZHANG JUNCUI
Format Patent
LanguageChinese
English
Published 18.09.2013
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:The invention relates to a circuit board which comprises a substrate, at least one bonding pad arranged on the substrate and metal coating coated on the substrate. Each bonding pad comprises copper foil arranged on the substrate in a sinking manner and solder mask annularly arranged around the copper coil. An opening is further formed at the central position of the copper coil, and the opening is coated with the solder mask. The metal coating is coated on the copper coil so as to form a dent corresponding to the opening. The invention further provides a manufacturing method of the circuit board.
Bibliography:Application Number: CN201210067784