Circuit board and manufacturing method of circuit board
The invention relates to a circuit board which comprises a substrate, at least one bonding pad arranged on the substrate and metal coating coated on the substrate. Each bonding pad comprises copper foil arranged on the substrate in a sinking manner and solder mask annularly arranged around the coppe...
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| Main Authors | , , , |
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| Format | Patent |
| Language | Chinese English |
| Published |
18.09.2013
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| Subjects | |
| Online Access | Get full text |
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| Abstract | The invention relates to a circuit board which comprises a substrate, at least one bonding pad arranged on the substrate and metal coating coated on the substrate. Each bonding pad comprises copper foil arranged on the substrate in a sinking manner and solder mask annularly arranged around the copper coil. An opening is further formed at the central position of the copper coil, and the opening is coated with the solder mask. The metal coating is coated on the copper coil so as to form a dent corresponding to the opening. The invention further provides a manufacturing method of the circuit board. |
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| AbstractList | The invention relates to a circuit board which comprises a substrate, at least one bonding pad arranged on the substrate and metal coating coated on the substrate. Each bonding pad comprises copper foil arranged on the substrate in a sinking manner and solder mask annularly arranged around the copper coil. An opening is further formed at the central position of the copper coil, and the opening is coated with the solder mask. The metal coating is coated on the copper coil so as to form a dent corresponding to the opening. The invention further provides a manufacturing method of the circuit board. |
| Author | ZHANG CUICUI ZHANG JUNCUI PENG XIAOZHAN NIE QIANG |
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| Notes | Application Number: CN201210067784 |
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| PublicationDateYYYYMMDD | 2013-09-18 |
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| PublicationYear | 2013 |
| RelatedCompanies | HONGFUJIN PRECISION INDUSTRY (SHENZHEN) CO., LTD HON HAI PRECISION INDUSTRY CO., LTD |
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| Snippet | The invention relates to a circuit board which comprises a substrate, at least one bonding pad arranged on the substrate and metal coating coated on the... |
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| SubjectTerms | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| Title | Circuit board and manufacturing method of circuit board |
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