Resin composition for cleaning mold and method for cleaning mold
The present invention provides a resin composition which is used for cleaning a mold for cleaning mold dirt caused by various kinds of thermosetting resins and has high cleaning performance. The resin composition for cleaning the mold comprises the following components: ethylene-propylene rubber; bu...
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Main Authors | , , |
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Format | Patent |
Language | Chinese English |
Published |
18.09.2013
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Subjects | |
Online Access | Get full text |
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Summary: | The present invention provides a resin composition which is used for cleaning a mold for cleaning mold dirt caused by various kinds of thermosetting resins and has high cleaning performance. The resin composition for cleaning the mold comprises the following components: ethylene-propylene rubber; butadiene rubber; at least one detergent selected from a group which is composed of urea, derivatives thereof, monocyclic monoterpene, ethyl acetate comprising alkyls with 4-6 carbon atoms, an alcohol with 4-6 carbon atoms, and a compound represented by a formula 1. In the formula 1, X represents oxygen atom or NR'; R and R' respectively represent hydrogen atom, alkyls with 1-4 carbon atoms, or hydroxyalkyl with 2-4 carbon atoms. |
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Bibliography: | Application Number: CN201310077864 |