Circuit connection structure, method for manufacturing same, and semiconductor substrate for circuit connection structure

• Main Authors: ITABASHI TOSHIAKI, KANEYA YUICHI, TANAKA TOSHIAKI
• Format: Patent
• Language: Chinese; English
• Published: 21.08.2013
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

A circuit connection structure which exhibits an excellent adhesiveness between a heat resistant resin film and a circuit adhesive member even under high temperature and high humidity by introducing a chemically stable functional group into the heat resistant resin film by additional surface treatment to improve the adhesiveness is provided. In a circuit connection structure 1A, a semiconductor substrate 2 and a circuit member 3 are adhered by a circuit adhesive member 4 sandwiched therewith. First circuit electrode 5 on the semiconductor substrate 2 and second circuit electrode 7 on the circuit member 3 are connected electrically by conductive particles 8 in the circuit adhesive member 4. A surface modification is given to the semiconductor substrate 2 by plasma treatment using gas containing nitrogen, ammonia and the like. Therefore, the heat resistant resin film 5 on the semiconductor substrate 2 and the circuit adhesive member 4 are firmly adhered for a long period of time even under the high temperature