Method for epitaxial growth of III nitride semiconductor material on silicon substrate

The invention relates to a method for epitaxial growth of an III nitride semiconductor material on a silicon substrate. The method comprises the following steps of forming a crystalline state Si3N4 layer on the surface of the silicon substrate firstly; then introducing an aluminum source so as to co...

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Bibliographic Details
Main Authors HU JIANNAN, LUO YI, NIU LANG, WANG LAI, HAO ZHIBIAO
Format Patent
LanguageChinese
English
Published 21.08.2013
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Summary:The invention relates to a method for epitaxial growth of an III nitride semiconductor material on a silicon substrate. The method comprises the following steps of forming a crystalline state Si3N4 layer on the surface of the silicon substrate firstly; then introducing an aluminum source so as to convert the crystalline state Si3N4 layer into an AlN (aluminum nitride) nucleating layer; and finally conducting epitaxial growth of the III nitride semiconductor material on the AlN nucleating layer. According to the method, the crystalline state Si3N4 layer is formed by nitriding the surface of the silicon substrate, and the AlN nucleating layer is formed by aluminizing of the crystalline state Si3N4 layer, so that the problem of lattice mismatch between the silicon substrate and the III nitride semiconductor material is solved, and the epitaxial growth of high quality III nitride semiconductor material on the silicon substrate is realized. The method for epitaxial growth of the III nitride semiconductor material
Bibliography:Application Number: CN20131145404