Method for manufacturing multi-layer circuit board with internal connecting finger

• Main Authors: ZHANG JUNJIE, LI XUEMING, HAN QILONG, JIANG XUEFEI, LIU KEMIN, PENG WEIHONG
• Format: Patent
• Language: Chinese; English
• Published: 14.08.2013
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The invention discloses a method for manufacturing a multi-layer circuit board with an internal connecting finger. The method comprises the following steps: first, manufacturing an inner layer boards, laminating the inner layer boards into a multilayer board, making a pattern on the multilayer board to form the connecting finger, and performing electrogilding treatment on the connecting finger; and then forming a window, which is wider than the connecting finger, in a non-flowing prepreg, enabling the window of the non-flowing prepreg to correspond to the connecting finger of the multilayer board in position, covering the upper surface and the lower surface of the non-flowing prepreg with copper foil, laminating the non-flowing prepreg and the connecting finger together, cutting off copper foil in a position corresponding to the connecting finger on the multilayer board to form the stepped multi-layer circuit board with the internal connecting finger. The connecting finger part of the multi-layer circuit boar