Wire tool
A wire tool includes a wire including a metal, a plating layer disposed on a surface of the wire, a plurality of diamond particles disposed over the plating layer, and a protection layer each covering the diamond particles and including phosphorus (P).
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Main Authors | , |
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Format | Patent |
Language | Chinese English |
Published |
24.07.2013
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Subjects | |
Online Access | Get full text |
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Summary: | A wire tool includes a wire including a metal, a plating layer disposed on a surface of the wire, a plurality of diamond particles disposed over the plating layer, and a protection layer each covering the diamond particles and including phosphorus (P). |
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Bibliography: | Application Number: CN2011838921 |