Wire tool

A wire tool includes a wire including a metal, a plating layer disposed on a surface of the wire, a plurality of diamond particles disposed over the plating layer, and a protection layer each covering the diamond particles and including phosphorus (P).

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Bibliographic Details
Main Authors WEN HUANJUN, LIU MINHAO
Format Patent
LanguageChinese
English
Published 24.07.2013
Subjects
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Summary:A wire tool includes a wire including a metal, a plating layer disposed on a surface of the wire, a plurality of diamond particles disposed over the plating layer, and a protection layer each covering the diamond particles and including phosphorus (P).
Bibliography:Application Number: CN2011838921