Process for preparing modified epoxy resin composition

• Main Authors: SEIJI MATSUURA, GOROU SUZUKI
• Format: Patent
• Language: English
• Published: 15.05.1996
• Edition: 6
• Subjects: ADHESIVES; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COMPOSITIONS BASED THEREON; CORRECTING FLUIDS; DYES; FILLING PASTES; INKS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS THEREFOR; WOODSTAINS

Disclosed is a modified epoxy resin composition comprising a resin having recurring units represented by the following general formula: for H or -CH3, R3 stands for H or a halogen atom, and having an epoxy group, a phenolic hydroxyl group and a primary alcoholic hydroxyl group as terminal functional...