Process for preparing modified epoxy resin composition

Disclosed is a modified epoxy resin composition comprising a resin having recurring units represented by the following general formula: for H or -CH3, R3 stands for H or a halogen atom, and having an epoxy group, a phenolic hydroxyl group and a primary alcoholic hydroxyl group as terminal functional...

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Bibliographic Details
Main Authors SEIJI MATSUURA, GOROU SUZUKI
Format Patent
LanguageEnglish
Published 15.05.1996
Edition6
Subjects
ADHESIVES
CHEMICAL PAINT OR INK REMOVERS
CHEMISTRY
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS
COMPOSITIONS BASED THEREON
CORRECTING FLUIDS
DYES
FILLING PASTES
INKS
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
PASTES OR SOLIDS FOR COLOURING OR PRINTING
POLISHES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF MATERIALS THEREFOR
WOODSTAINS
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Summary:Disclosed is a modified epoxy resin composition comprising a resin having recurring units represented by the following general formula: for H or -CH3, R3 stands for H or a halogen atom, and having an epoxy group, a phenolic hydroxyl group and a primary alcoholic hydroxyl group as terminal functional groups in specific amounts. This composition has a high reactivity with an active methylol group, and when this composition is combined with a curing agent resin such as an amino resin or a phenolic resin, a coating having an excellent bending processability is obtained.
Bibliography:Application Number: CN19891001744