Electronic component mounting apparatus, and electronic component mounting method

• Main Authors: IKEBE HITOSHI, SATO YUSUKE, TAKAHASHI MASATO, FUJIMOTO KAZUYA, TAKAHASHI HIROSHI, KOBAYASHI HITOSHI, KODAMA YUSUKE, SAITO AKARI, SATO YOSHITAKA
• Format: Patent
• Language: Chinese; English
• Published: 15.05.2013
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The invention provides an electronic component mounting apparatus and electronic component mounting method, a can having a through-hole on the base plate with high efficiency and high accuracy of the electronic component mounted thereon. a substrate conveying part; a component feeding unit, which has at least one electronic component is used for supplying the leads of the electronic component supplying device; mounting the head main body; a shooting device which is fixed on the mounting head on a supporting body, the substrate is captured; a storage unit; and a control part for controlling the mounting head body, a shooting device and a component feeding unit, the control unit uses the action of the shooting devices formed on a substrate through hole, a substrate surface of a wiring pattern is formed as a reference mark, according to the acquired from a captured image of the reference marker of the reference mark of the correction value, according to the reference marker corrected through hole position and fr