Microphone module

A microphone module comprises an outer shell, a circuit board contained in the outer shell, and a microphone contained in the outer shell and connected with the circuit board. The outer shell comprises a bottom cover and a shell body integrated with the bottom cover, a sound hole is formed in the sh...

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Bibliographic Details
Main Author CHEN HUANGMIAO
Format Patent
LanguageChinese
English
Published 08.05.2013
Subjects
DEAF-AID SETS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS
PUBLIC ADDRESS SYSTEMS
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Summary:A microphone module comprises an outer shell, a circuit board contained in the outer shell, and a microphone contained in the outer shell and connected with the circuit board. The outer shell comprises a bottom cover and a shell body integrated with the bottom cover, a sound hole is formed in the shell body, a gasket is arranged between the shell body and the microphone, a cavity is formed in the gasket, the hole diameter of the cavity is larger than the hole diameter of the sound hole formed in the shell body, the cavity is communicated with the sound hole, and a helmholtz resonant cavity is formed outside the cavity, the sound hole and the microphone. According to the microphone module, the helmholtz resonant cavity is formed outside the microphone by fully utilizing the gap between the shell body and the microphone, voicebands are favorable for being widened, lowest sound resonance frequency is favorable for being lessened, and therefore the low frequency response effect of microphone module is improved.
Bibliography:Application Number: CN20111349548