Apparatus and method

The invention is related to an apparatus and a method for processing a surface (4) of a substrate (2) by exposing the surface (4) of the substrate (2) to alternating surface reactions of at least a first starting material (A) and a second starting material (B) according to the principles of atomic l...

Full description

Saved in:
Bibliographic Details
Main Authors SNECK SAMI, SOININEN PEKKA
Format Patent
LanguageChinese
English
Published 01.05.2013
Subjects
Online AccessGet full text

Cover

Loading…
Abstract The invention is related to an apparatus and a method for processing a surface (4) of a substrate (2) by exposing the surface (4) of the substrate (2) to alternating surface reactions of at least a first starting material (A) and a second starting material (B) according to the principles of atomic layer deposition method. According to the invention a first starting material (A) is fed on the surface (4) of the substrate (2) locally by means of a source (6, 7, 8) by moving the source (6, 7, 8) in relation to the substrate (2), and the surface (4) of the substrate (2) processed with the first starting material (A) is exposed to a second starting material (B) present in the atmosphere (1 ) surrounding the source (6, 7, 8).
AbstractList The invention is related to an apparatus and a method for processing a surface (4) of a substrate (2) by exposing the surface (4) of the substrate (2) to alternating surface reactions of at least a first starting material (A) and a second starting material (B) according to the principles of atomic layer deposition method. According to the invention a first starting material (A) is fed on the surface (4) of the substrate (2) locally by means of a source (6, 7, 8) by moving the source (6, 7, 8) in relation to the substrate (2), and the surface (4) of the substrate (2) processed with the first starting material (A) is exposed to a second starting material (B) present in the atmosphere (1 ) surrounding the source (6, 7, 8).
Author SOININEN PEKKA
SNECK SAMI
Author_xml – fullname: SNECK SAMI
– fullname: SOININEN PEKKA
BookMark eNrjYmDJy89L5WQQcSwoSCxKLCktVkjMS1HITS3JyE_hYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxzn6GBsYGFgbG5saOxsSoAQAFeyJQ
ContentType Patent
DBID EVB
DatabaseName esp@cenet
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EVB
  name: esp@cenet
  url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Medicine
Chemistry
Sciences
ExternalDocumentID CN103080373A
GroupedDBID EVB
ID FETCH-epo_espacenet_CN103080373A3
IEDL.DBID EVB
IngestDate Fri Jul 19 14:55:57 EDT 2024
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language Chinese
English
LinkModel DirectLink
MergedId FETCHMERGED-epo_espacenet_CN103080373A3
Notes Application Number: CN201180041761
OpenAccessLink https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130501&DB=EPODOC&CC=CN&NR=103080373A
ParticipantIDs epo_espacenet_CN103080373A
PublicationCentury 2000
PublicationDate 20130501
PublicationDateYYYYMMDD 2013-05-01
PublicationDate_xml – month: 05
  year: 2013
  text: 20130501
  day: 01
PublicationDecade 2010
PublicationYear 2013
RelatedCompanies BENEQ OY
RelatedCompanies_xml – name: BENEQ OY
Score 2.9995728
Snippet The invention is related to an apparatus and a method for processing a surface (4) of a substrate (2) by exposing the surface (4) of the substrate (2) to...
SourceID epo
SourceType Open Access Repository
SubjectTerms CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
Title Apparatus and method
URI https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130501&DB=EPODOC&locale=&CC=CN&NR=103080373A
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwY2BQAR1RbpBsmqKbamyZpGtiYpCom5hsYgTsqphaJielWpgaJYM2J_v6mXmEmnhFmEYwMWTB9sKAzwktBx-OCMxRycD8XgIurwsQg1gu4LWVxfpJmUChfHu3EFsXNWjvGFggmwL7xi5Otq4B_i7-zmrOzrbOfmp-Qbag27QsDIzNjR2ZGViBzWhzUG5wDXMC7UopQK5S3AQZ2AKApuWVCDEwVWUIM3A6w25eE2bg8IVOeAOZ0LxXLMIgAmwwgs7pLi1WAPb-FSBXP4syKLq5hjh76AKNj4f7Jd7ZD-ESYzEGFmAfP1WCQcEgJS0xxcTMKDEx2RhYZ6YmWQI7jmYmpkA6DXQwkiSDFG5zpPBJSjNwGYFvcACt0ZNhYCkpKk2VBdajJUly4AAAAL0-dQ4
link.rule.ids 230,309,783,888,25576,76876
linkProvider European Patent Office
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwY2BQAR1RbpBsmqKbamyZpGtiYpCom5hsYgTsqphaJielWpgaJYM2J_v6mXmEmnhFmEYwMWTB9sKAzwktBx-OCMxRycD8XgIurwsQg1gu4LWVxfpJmUChfHu3EFsXNWjvGFggmwL7xi5Otq4B_i7-zmrOzrbOfmp-Qbag27QsDIzNjR2ZGViBTWxzUG5wDXMC7UopQK5S3AQZ2AKApuWVCDEwVWUIM3A6w25eE2bg8IVOeAOZ0LxXLMIgAmwwgs7pLi1WAPb-FSBXP4syKLq5hjh76AKNj4f7Jd7ZD-ESYzEGFmAfP1WCQcEgJS0xxcTMKDEx2RhYZ6YmWQI7jmYmpkA6DXQwkiSDFG5zpPBJyjNweoT4-sT7ePp5SzNwGYFvcwCt15NhYCkpKk2VBdapJUly4MAAAGUHeAE
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Apparatus+and+method&rft.inventor=SNECK+SAMI&rft.inventor=SOININEN+PEKKA&rft.date=2013-05-01&rft.externalDBID=A&rft.externalDocID=CN103080373A