Wafer brushing device and wafer brushing method

The invention discloses a wafer brushing device and a wafer brushing method. The wafer brushing device comprises a rack, a first hair brush, a second hair brush, a first cleaning solution supply unit and a second cleaning solution supply unit, wherein the first hair brush and the second hair brush a...

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Bibliographic Details
Main Authors LU XINCHUN, PEI ZHAOHUI, MEI HEGENG, HE YONGYONG
Format Patent
LanguageChinese
English
Published 01.05.2013
Subjects
BASIC ELECTRIC ELEMENTS
CLEANING
CLEANING IN GENERAL
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
PREVENTION OF FOULING IN GENERAL
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:The invention discloses a wafer brushing device and a wafer brushing method. The wafer brushing device comprises a rack, a first hair brush, a second hair brush, a first cleaning solution supply unit and a second cleaning solution supply unit, wherein the first hair brush and the second hair brush are oppositely arranged on the rack at intervals and are used for respectively brushing two side surfaces of a wafer; the first cleaning solution supply unit and the second cleaning solution supply unit are oppositely arranged on the rack at intervals and are used for respectively supplying a cleaning solution to the two side surfaces of the wafer; and the quantity of the cleaning solution supplied by each of the first and second cleaning solution supply units is increased from inside to outside along the radial direction of the wafer. According to the wafer brushing device disclosed by the embodiment of the invention can be used for improving the wafer brushing efficiency, reducing the wafer brushing time and reduc
Bibliography:Application Number: CN2013123763