Printed circuit comprising at least one ceramic component
The invention relates to a printed circuit comprising a substrate (1) onto which at least one ceramic component (2, 3, 4) is attached so as to enable the heat produced by the ceramic component (2, 3, 4) to be discharged and to prevent cracks in the ceramic component (2, 3, 4) and in the substrate (1...
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Main Author | |
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Format | Patent |
Language | Chinese English |
Published |
24.04.2013
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Subjects | |
Online Access | Get full text |
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Summary: | The invention relates to a printed circuit comprising a substrate (1) onto which at least one ceramic component (2, 3, 4) is attached so as to enable the heat produced by the ceramic component (2, 3, 4) to be discharged and to prevent cracks in the ceramic component (2, 3, 4) and in the substrate (1). To this end, the ceramic component (2, 3, 4) is attached onto the substrate (1) by means of two connectors (5, 6) made of metal matrix composite material. Said two connectors further preferably have incisions so as to enable the mechanical stresses exerted in the substrate to be carried over into the connectors. |
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Bibliography: | Application Number: CN201180040973 |