Self-packaged MEMS (micro-electro-mechanical systems) device and infrared sensor

• Main Authors: ZHAO DANQI, WANG WEI, TIAN DAYU, LIU PENG, HUANG XIAN, LI TING, ZHANG DACHENG, HE JUN, LUO KUI, YANG FANG
• Format: Patent
• Language: Chinese; English
• Published: 24.04.2013
• Subjects: COLORIMETRY; MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT,POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED,VISIBLE OR ULTRA-VIOLET LIGHT; MEASURING; MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES; MICROSTRUCTURAL TECHNOLOGY; PERFORMING OPERATIONS; PHYSICS; RADIATION PYROMETRY; TESTING; TRANSPORTING

The invention discloses a self-packaged MEMS (micro-electro-mechanical systems) device manufactured based on surface sacrificial layer process, and an infrared sensor with the self-packaged MEMS device structure. The self-packaged MEMS device comprises a base plate, a substrate protective layer, a lower electrode, a lower electrode protective layer, a structural layer, a metal layer and a package layer. The structural layer and the metal layer are located in a package chamber formed by the package layer. The package chamber is formed by sticking the package layer onto the lower electrode protective layer according to the adhesion effect when the MEMS device structure is released. The self-packaged MEMS device is applicable to moving-structure MEMS devices such as the infrared sensors. The MEMS device and the package are completed together, so that packaging cycle is shortened and process quality and yield are high. The self-packaged MEMS device is applicable to large-scale batch production.