Cutting method of light emitting element package with ceramic substrate and cutting method of workpiece with multi-layer structure

A method of cutting light emitting element packages includes preparing a ceramic substrate (10) having a surface (12) on which a plurality of light emitting element chips (20) are mounted and a light-transmitting material layer (30) is formed to cover the plurality of light emitting element chips (2...

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Bibliographic Details
Main Authors LEE DONG HUN, JI WON SOO, KIM EUI SEOK, KIM CHOO HO, JUN HEE YOUNG, RHEE SHIN MIN
Format Patent
LanguageChinese
English
Published 17.04.2013
Subjects
BASIC ELECTRIC ELEMENTS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:A method of cutting light emitting element packages includes preparing a ceramic substrate (10) having a surface (12) on which a plurality of light emitting element chips (20) are mounted and a light-transmitting material layer (30) is formed to cover the plurality of light emitting element chips (20),partially removing the light-transmitting material layer (30) between the plurality of light emitting element chips (20) along a cutting line (C) by using a mechanical cutting method,and separating individual light emitting element packages by cutting the ceramic substrate (10) along the cutting line (C) by using a laser cutting method.
Bibliography:Application Number: CN20121175249