Special ultraviolet curing pressure-sensitive adhesive tape for silicon wafer cutting and preparation method of adhesive tape

• Main Authors: ZHU DONGHAI, XU XIANCHENG, DING JUN, LIU HONGLE, LI MINGYONG, XU XIUTAO, WANG MING
• Format: Patent
• Language: Chinese; English
• Published: 10.04.2013
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; DYES; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES

The invention discloses a special ultraviolet curing pressure-sensitive adhesive tape for silicon wafer cutting. The ultraviolet curing pressure-sensitive adhesive tape consists of a polyester release film, ultraviolet curing pressure-sensitive adhesive and a film substrate, wherein the ultraviolet curing pressure-sensitive adhesive is mixed by 96.5-99 parts by mass of acrylate pre-poly resin, 96.5-99 parts by mass of polyurethane acrylate, 1-2 parts by mass of ultraviolet photoinitiator, and 1-5 parts by mass of curing agent. The preparation method comprises the following steps that the film substrate with a thickness of 0.05-0.25mm and a width of 500-2500mm is glued on a coating machine, is composited with the polyester release film with a thickness of 0.025-0.05mm and a width of 500-2500mm at 0.4MPa and at a room temperature, and finally is put into a 40-50 DEG C drying room for curing for 48-72h to form the pressure-sensitive adhesive tape. The prepared adhesive tape can also be used for the cutting of pr