Multiple chip package (MCP) form of thermistor and wireless body temperature detection circuit

The invention discloses an MCP form of a thermistor and a wireless body temperature detection circuit. A system is composed of a thermistor probe, a wireless body temperature detection circuit chip, a base material, an antenna, a fixing glue layer, a conductive pin and packaging filling bodies. The...

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Bibliographic Details
Main Authors WANG XIN'AN, DAI PENG, SHEN JINPENG, YONG SHANSHAN, HUANG JINFENG
Format Patent
LanguageChinese
English
Published 27.03.2013
Subjects
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Summary:The invention discloses an MCP form of a thermistor and a wireless body temperature detection circuit. A system is composed of a thermistor probe, a wireless body temperature detection circuit chip, a base material, an antenna, a fixing glue layer, a conductive pin and packaging filling bodies. The MCP structure comprises that the wireless body temperature detection circuit chip is fixed on the base material through the fixing glue layer, the conductive pin of the chip is connected with the antenna and the thermistor probe, and connection positions of the chip, the conductive pin, the antenna and the thermistor probe are wrapped by the packaging filling bodies. By the aid of the MCP form, the system is small in size, low in cost, simple to manufacture and easy to use.
Bibliography:Application Number: CN20111268288