Light emitting diode disposed on heat dissipating device

• Main Authors: KOMETEK J, STERANKA F.M, ZHANG L, WALL F.J, VERCAMP J.W
• Format: Patent
• Language: Chinese; English
• Published: 27.02.2013
• Subjects: BASIC ELECTRIC ELEMENTS; BLASTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF; HEATING; INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED; LIGHTING; MECHANICAL ENGINEERING; NON-PORTABLE LIGHTING DEVICES; SEMICONDUCTOR DEVICES; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLEEXTERIORS; WEAPONS

The invention discloses a light emitting diode disposed on a heat dissipating device. The heat dissipating device is provided with a front surface having an opening. The device comprises a carrier, at least one LED tube core, and a heat conducting embedded block provided with a first area and a second area. The first area is coupled with the carrier thermally, and a second area is provided with a column protruding outward. The column is operably accommodated in the opening in the heat dissipating device, and the LED device can be fixedly disposed on the heat dissipating device, therefore the second area is coupled with the front surface of the heat dissipating device. The invention also discloses other embodiments, wherein the LED device can be installed by bonding the heat conducting material (196),the elastic locking plate, or welding or inserting hooks.