Copper member having hybrid joint structure for forming sealed space, and joining method thereof

• Main Authors: KIM JUN-KI, KIM JEONG-HAN, BANG JUNG-HWAN, KIM CHEOL-HEE, YOO SE-HOON, KIM JONG-HOON, LEE CHANG-WOO, KO YONG-HO
• Format: Patent
• Language: English
• Published: 08.04.2015
• Subjects: BLASTING; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CLADDING OR PLATING BY SOLDERING OR WELDING; CONSTRUCTIONAL DETAILS OF INSTRUMENTS, OR COMPARABLE DETAILSOF OTHER APPARATUS, NOT OTHERWISE PROVIDED FOR; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS ORMACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS,CLIPS, WEDGES, JOINTS OR JOINTING; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS; HEATING; INSTRUMENT DETAILS; LIGHTING; MACHINE TOOLS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MECHANICAL ENGINEERING; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; PHYSICS; PRINTED CIRCUITS; SOLDERING OR UNSOLDERING; THERMAL INSULATION IN GENERAL; TRANSPORTING; WEAPONS; WELDING; WORKING BY LASER BEAM

A copper member forming a sealed space of the present invention includes an upper coupling plate of a copper material, and a lower coupling plate of a copper material that is coupled to the upper coupling plate. A sealed space, in which a functional material is filled, is formed between the upper coupling plate and the lower coupling plate. The upper coupling plate and the lower coupling plate include body portions on which bonding surfaces, for applying an adhesive along the perimeter of the sealed space, are formed. Included is a fixing part installed between bonding surfaces of the upper coupling plate and the lower coupling plate, for fixing the upper coupling plate and the lower coupling plate.