Heating curing type modified acrylate pressure sensitive adhesive and preparation method thereof

• Main Authors: QIN CHANG, XIE HAIHUA, WANG JIANBIN, CHEN TIANAN
• Format: Patent
• Language: Chinese; English
• Published: 20.02.2013
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; DYES; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES

The present invention relates to a heating curing type modified acrylate pressure sensitive adhesive and a preparation method thereof. The method comprises the following steps: 1) adding a mixed solvent comprising a soft monomer, a hard monomer, a modified monomer, ethyl acetate and toluene to a reaction kettle, uniformly mixing, and carrying out first heating to obtain a mixture A; 2) adding an initiator solution to the mixture A obtained from the step 1) in a dropwise manner, carrying out second heating, carrying out a reaction after the second heating, carrying out third heating, and continuously carrying out the reaction after the third heating to obtain a mixture B; 3) cooling the mixture B obtained from the step 3), slowly adding an epoxy resin and the mixed solvent, completely dissolving, adding a benzoxazine resin, completely dissolving, then adding a high purity linear phenol-formaldehyde resin, and carrying out a reaction to obtain a mixture C; and 4) adopting a solvent to adjust viscosity of the mi