Multiple gate dielectric structures and methods of forming the same

The present disclosure provides for multiple gate dielectric semiconductor structures and methods of forming such structures. In one embodiment, a method of forming a semiconductor structure includes providing a substrate including a pixel array region, an input/output (I/O) region, and a core regio...

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Bibliographic Details
Main Authors YAUNG DUN NIAN, KAO MIN FENG, LIU JEN CHENG, TSENG HSIAO HUI, HSU WEN I
Format Patent
LanguageChinese
English
Published 13.02.2013
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Summary:The present disclosure provides for multiple gate dielectric semiconductor structures and methods of forming such structures. In one embodiment, a method of forming a semiconductor structure includes providing a substrate including a pixel array region, an input/output (I/O) region, and a core region. The method further includes forming a first gate dielectric layer over the pixel array region, forming a second gate dielectric layer over the I/O region, and forming a third gate dielectric layer over the core region, wherein the first gate dielectric layer, the second gate dielectric layer, and the third gate dielectric layer are each formed to be comprised of a different material and to have a different thickness.
Bibliography:Application Number: CN20121115555