Metallographical sample-filling secondary glue filling method

• Main Authors: WANG LISHENG, CHEN WENLU, LIU LIGUO, LI XIAOMING, WU NINGBIAO, JIA YAN
• Format: Patent
• Language: English
• Published: 08.07.2015
• Subjects: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MEASURING; PHYSICS; TESTING