Adhesive tape for manufacturing semiconductor devices and method for manufacturing semiconductor devices by using adhesive tape

• Main Authors: KIM YEON SHOO, SHIM CHANG HEUN, HEE GEE CHONG, BA GYONG MIN, CHOE SEUNG HWAN
• Format: Patent
• Language: Chinese; English
• Published: 06.02.2013
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE; USE OF MATERIALS AS ADHESIVES

The present invention provides an adhesive tape for manufacturing semiconductor devices and a method for manufacturing semiconductor devices by using the adhesive tape. The adhesive tape comprises a substrate and an adhesive layer coated on at least one surface of the substrate. The adhesive layer i...