Adhesive tape for manufacturing semiconductor devices and method for manufacturing semiconductor devices by using adhesive tape

• Main Authors: KIM YEON SHOO, SHIM CHANG HEUN, HEE GEE CHONG, BA GYONG MIN, CHOE SEUNG HWAN
• Format: Patent
• Language: Chinese; English
• Published: 06.02.2013
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE; USE OF MATERIALS AS ADHESIVES

The present invention provides an adhesive tape for manufacturing semiconductor devices and a method for manufacturing semiconductor devices by using the adhesive tape. The adhesive tape comprises a substrate and an adhesive layer coated on at least one surface of the substrate. The adhesive layer is formed by an adhesive composition. The adhesive composition contains, based on 100 parts by weight of a carboxyl group-containing rubber resin, about 0.01-10 parts by weight of a curing agent and about 60-100 parts by weight of additives. The adhesive tape maintains low adhesive strength at room temperature during lamination after the installation process as the high-temperature process, so that when lamination defects occurs, re-processing can be easily performed and the product yield is improved, and the tackiness on the surface of a lead frame is improved of the adhesive tape the pre-curing process after the laminate, thereby effectively preventing the leakage of resin in the sealing process and residues are n