Substrate processing apparatus and substrate processing method

The invention provides a substrate processing apparatus and a substrate processing method which are capable of preventing pollution to be caused by discharge heads and nozzle arms for holding the discharge heads. The nozzle arms (62) for holding the discharge heads are caused by a pivotal driving pa...

Full description

Saved in:
Bibliographic Details
Main Authors OSADA NAOYUKI, SUGIMOTO KENTARO
Format Patent
LanguageChinese
English
Published 23.01.2013
Subjects
BASIC ELECTRIC ELEMENTS
CLEANING
CLEANING IN GENERAL
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
PREVENTION OF FOULING IN GENERAL
SEMICONDUCTOR DEVICES
TRANSPORTING
Online AccessGet full text

Cover

More Information
Summary:The invention provides a substrate processing apparatus and a substrate processing method which are capable of preventing pollution to be caused by discharge heads and nozzle arms for holding the discharge heads. The nozzle arms (62) for holding the discharge heads are caused by a pivotal driving part (63) to move between a processing position above a substrate W and a standby position outside a processing cup surrounding a substrate W. When the nozzle arms (62) having cleaned a substrate W is placed at the standby position, a cleaning solution is ejected from a shower nozzle (71) toward the nozzle arms (62) arranged obliquely downward of the shower nozzle. The three nozzle arms (62) are caused to move up and down such that the nozzle arms (62) cut across a jet of a cleaning solution discharged obliquely downward, thereby cleaning the three nozzle arms (62) in order. Then, a nitrogen gas is ejected from a drying gas nozzle (76) and sprayed on the nozzle arms (62) to remove the cleaning solution attached to th
Bibliography:Application Number: CN20121253759