Method For Manufacturing A Nanoporous Ultra-low Dielectric Thin Film Including A High-temperature Ozone Treatment And Nanoporous Ultra-low Dielectric Thin Film Manufactured By The Method

• Main Authors: SHIN BO RA, CHOI KYU YOON, KIM BUM SU, RHEE HEE WOO
• Format: Patent
• Language: Chinese; English
• Published: 02.01.2013
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TRANSPORTING

Provided are a method for manufacturing a nanoporous ultra-low dielectric thin film including a high-temperature ozone treatment, and a nanoporous ultra-low dielectric thin film manufactured by the method. The method comprises: preparing a solution mixture by mixing a solution containing organic silicate matrix and a solution containing reactive porogen; forming a thin film by coating a substrate with the solution mixture; and performing thermal treatment on the thin film, and performing ozone treatment during the thermal treatment. A nanoporous ultra-low dielectric thin film manufactured by the method can have a permittivity of 2.3 or less and a mechanical strength of 10 GPa or more by improving size and distribution of pores in the thin film by virtue of high-temperature ozone treatment and optimized treatment temperature.