Low-dielectric loss phenolic aldehyde laminating paper board and manufacturing method thereof

• Main Authors: ZHANG SHUWEN, LI JUAN, SI LINGXIA
• Format: Patent
• Language: Chinese; English
• Published: 26.12.2012
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; IMPREGNATING OR COATING OF PAPER; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PAPER NOT OTHERWISE PROVIDED FOR; PAPER-MAKING; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; PRODUCTION OF CELLULOSE; PULP COMPOSITIONS; TEXTILES; THEIR PREPARATION OR CHEMICAL WORKING-UP; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G

The invention relates to a low-dielectric loss phenolic aldehyde laminating paper board and a manufacturing method thereof. The method is simple and rapid in step, and due to the use of the phenolic aldehyde laminating paper board obtained by using the method, the dielectric loss factor is small, the electric strength is large and the breakdown voltage is high. The manufacturing method of the low-dielectric loss phenolic aldehyde laminating paper board comprises the following steps: directly dipping paper by using matrix resin dissolving liquid or mixed resin dissolving liquid, then baking the paper to obtain a prepreg, and conducting lamination and hot pressing molding on the preprg, wherein a preparation method of the matrix resin dissolving liquid comprises the steps of a. uniformly mixing phenol, dimethylbenzene formaldehyde and p-toluenesulfonic acid, and reacting to obtain a mixture 1; and b. adding triethanolamine in the mixture 1, then adding formaldehyde, triethylamine and ammonia water for reaction,