Electronic component mounting method

A method of mounting an electronic component allows bumps to land onto electrodes via thermosetting flux formed of first thermosetting resin containing a first active ingredient, and brings a resin reinforcing member formed of second thermosetting resin containing a second active ingredient into con...

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Bibliographic Details
Main Authors MOTOMURA KOJI, SAKAI TADAHIKO, SAEKI TSUBASA, WADA YOSHIYUKI, MUNAKATA HIRONORI
Format Patent
LanguageEnglish
Published 22.07.2015
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:A method of mounting an electronic component allows bumps to land onto electrodes via thermosetting flux formed of first thermosetting resin containing a first active ingredient, and brings a resin reinforcing member formed of second thermosetting resin containing a second active ingredient into contact with the electronic component at reinforcement sections, and then heats the substrate to form solder junction sections that bond the bumps to the electrodes. At the same time, the method forms resin reinforcement sections that reinforce the solder junction sections from the surroundings. A mixing ratio of the second active ingredient in the resin reinforcing member is set greater than a mixing ratio of the first active ingredient in the thermosetting flux.
Bibliography:Application Number: CN201180016066