Lighting device with built-in RF antenna

• Main Authors: ZHANG GUOPING, DENKER ROGER HENRI, LANKHORST MARTIJN HENRI RICHARD, CLAESSENS DENNIS JOHANNES ANTONIUS, SNELTEN JEROEN, HAENEN LUDO, KOOTEN PATRICK VAN, CHEN BINGZHOU, SELEN JACOBUS HUBERTUS ANNA
• Format: Patent
• Language: English
• Published: 29.04.2015
• Subjects: ANTENNAS, i.e. RADIO AERIALS; BASIC ELECTRIC ELEMENTS; BLASTING; ELECTRIC COMMUNICATION TECHNIQUE; ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF; HEATING; INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED; LIGHTING; MECHANICAL ENGINEERING; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR; TRANSMISSION; WEAPONS

A lighting device, such as a replacement lighting device, comprising a light source (LS), e.g. LEDs, for producing light along an optical axis (OA). A heat sink (HS) made of a material with an electrical resistivity being less than 0.01 Ωm, e.g. a metallic heat sink being a part of the housing, transports heat away from the light source (LS). A Radio Frequency (RF) communication circuit (CC) connected to an antenna (A) serves to enable RF signal communication, e.g. to control the device via a remote control. Metallic components, including the heat sink (HS), having an extension larger than 1/10 of a wavelength of the RF signal are arranged below a virtual plane (VP) drawn orthogonal to the optical axis (OA) and going through the antenna (A). Hereby a compact device can be obtained, and still a satisfying RF radiation pattern can be obtained. The antenna can be a wire antenna or a PCB antenna, e.g. a PIFA or a IFA type antenna. In a special embodiment the antenna is formed on a ring-shaped PCB with a central hole allowing passage of light from the light source. Preferably, the antenna is positioned at least 2 mm in front of the heat sink (HS).