Light-emitting diode packaging structure with symmetrical reflective framework and method for manufacturing light-emitting diode packaging structure

The invention relates to a light-emitting diode packaging structure with a symmetrical reflective framework and a method for manufacturing the light-emitting diode packaging structure. The light-emitting diode packaging structure with the symmetrical reflective framework comprises a base plate unit,...

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Bibliographic Details
Main Authors XIAO SONGYI, WANG BINGLONG
Format Patent
LanguageChinese
English
Published 28.11.2012
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The invention relates to a light-emitting diode packaging structure with a symmetrical reflective framework and a method for manufacturing the light-emitting diode packaging structure. The light-emitting diode packaging structure with the symmetrical reflective framework comprises a base plate unit, a light-emitting unit, a side frame unit and a packaging unit, wherein the light-emitting unit is provided with at least one light-emitting element which is arranged on the base plate unit and is electrically connected with the base plate unit; the side frame unit is provided with two side frames which are arranged on the base plate unit and are respectively positioned on two opposite sides of the light-emitting unit; and the packaging unit is provided with a packaging colloid which is arranged between the two side frames and covers the light-emitting unit. The side frames ensures that the light-emitting diode packaging structure is provided with the symmetrical reflective framework to fulfill the aim of adjusting
Bibliography:Application Number: CN20111136900