Precision spacing for stacked wafer assemblies

• Main Author: MARGALIT MORDEHAI
• Format: Patent
• Language: Chinese; English
• Published: 14.11.2012
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; PHYSICS; SEMICONDUCTOR DEVICES; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

An assembly (200) including a first wafer (202), a second wafer (202), a spacing wafer (204) configured to be positioned between the first wafer and the second wafer, and a plurality of spacing elements (216) configured to be positioned within the spacing wafer and to contact the first wafer and the second wafer, the spacing elements sized to define a spacing distance between the first wafer and the second wafer. A method for mounting a lens element (502) at a focus distance from a base layer (508) is also disclosed. The method comprises: affixing a plurality of spacing elements (504) to the lens element; applying a quantity of deformable material (506) to each of the plurality of spacing elements; applying a pressing force to the lens assembly and applying heat to the deformable material until a distance between the lens element and the base layer equals the focus distance.