Method of producing ceramic substrates

• Main Authors: MIYAZAWA SUGIO, OHASHI TSUNEAKI, WATANABE KEIICHIRO
• Format: Patent
• Language: Chinese; English
• Published: 24.10.2012
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PRINTED CIRCUITS; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TRANSPORTING; WORKING CEMENT, CLAY, OR STONE; WORKING STONE OR STONE-LIKE MATERIALS

A ceramic base plate is divided into a plurality of substrate regions 2 each having corner part 8. A dividing groove 7 is formed between the substrate regions 2 adjacent with each other. The corner part 8 of each of the substrate regions 2 faces a spacing 9B communicated with the dividing groove 7. At least a part of the corner part 8 is arc-shaped. The arc-shaped part of the corner part is tangent to a center line 7a of the dividing groove 7 at a cross point "P" of the spacing 9B with the dividing groove 7. The ceramic base plate is broken along the dividing groove 7 to produce ceramic substrates.